2025 China Ceramic Capacitor & Materials Technology Industry Development Forum and MLCC Annual Conference Successfully Held in Suzhou

2025 China Ceramic Capacitor & Materials Technology Industry Development Forum and MLCC Annual Conference Successfully Held in Suzhou

From April 24 to 25, 2025, the "2025 China Ceramic Capacitor & Materials Technology Industry Development Forum and China MLCC Annual Conference" was successfully held in Suzhou, Jiangsu Province. The event was hosted by the China Electronic Components Association (CECA), and co-organized by the CECA Science and Technology Committee CECA Capacitor Branch, and Beijing Yuanliu Hongyuan Electronic Technology Co Ltd.

Distinguished guests attending the forum included Li Ting, Director of the Basic Components Division of the Department of Electronic Information at the Ministry of Industry and Information Technology (MIIT); Yang Liang, Deputy Director of the Suzhou High-tech Zone Administrative Committee and Secretary of the Party Working Committee of Suzhou Science and Technology Town; Gu Qun, Executive Vice President of CECA; Liu Dexin, Vice President of Chaozhou Three-Circle (Group) Co., Ltd.; Zheng Xiaodan, Vice Chairman of Beijing Yuanliu Hongyuan Electronic Technology Co Ltd.; and Yang Xiaoping, President of Guangdong Fenghua Advanced Technology Holding Co., Ltd.

The conference brought together nearly 500 participants from leading ceramic capacitor manufacturers, upstream material and equipment suppliers, research institutes, universities, investment institutions, and media. Virtually all major domestic MLCC enterprises attended the event, with more than 50 companies showcasing their latest technologies and products on site.

In-Depth Industry Collaboration Drives Technological Advancement

The forum opened with remarks from Gu Qun, Executive Vice President of CECA, who emphasized that ceramic capacitors, known as the "cornerstone" of the electronics industry, are vital to the competitiveness of China's electronics supply chain. In 2024, China's ceramic capacitor industry recorded sales of RMB 50.6 billion, up 1.9% year-on-year. Notably, the global market share of domestic MLCC manufacturers rose from 4.4% in 2019 to 9.8% in 2024.

However, challenges remain: insufficient supply of high-end MLCCs, low localization of key materials, intense competition in single-layer capacitors, and heightened uncertainty due to international trade tensions. Gu called for deeper cross-industry collaboration, innovation-driven development, and enhanced technical capabilities. The forum, he noted, is an important platform for strengthening government-industry cooperation and integration of industry, academia, and research.

Li Ting, Director of the Basic Components Division at MIIT, delivered a keynote address emphasizing the Ministry’s commitment to promoting the high-quality development of the MLCC industry. She detailed the Ministry’s efforts in implementing supportive policies for consumption-driven demand expansion and boosting technological breakthroughs in high-end MLCCs, electronic pastes, and manufacturing equipment. Li noted that while domestic MLCCs have achieved industrial-scale progress, their global market share remains below 10%, with gaps in high-end materials and equipment. She highlighted plans to formulate the "15th Five-Year" industry roadmap, promote industrial cluster development, and advance international collaboration to drive China's electronic components sector toward higher-end development.

Zheng Xiaodan, Vice Chairman of Beijing Yuanliu Hongyuan Electronics, extended a warm welcome to participants, expressing gratitude to CECA and the Suzhou High-tech Zone. As a strategic component known as the "rice of the electronics industry," MLCCs play a foundational role in electronic systems. Zheng shared that Hongyuan Electronics has established four production bases across Beijing, Suzhou, Chengdu, and Hefei, with the Suzhou facility being recognized as a provincial intelligent manufacturing demonstration site. He emphasized that in the face of global supply chain uncertainties, innovation and craftsmanship are essential to driving industry transformation and sustainable growth.

Yang Liang, Deputy Director of Suzhou High-tech Zone, introduced the district’s industrial advantages and invited electronic component enterprises to participate in building the Taihu Science City and co-develop new frontiers in the MLCC industry.

Leading Experts Deliver Cutting-edge Insights

The forum featured 19 technical presentations from experts across the ceramic capacitor value chain, including academia, research institutes, and industry leaders:

• Prof. Li Baowen of Wuhan University of Technology presented on "High-Performance      Perovskite Nanosheet-Based Ceramic Capacitors";
• Prof. Zhou Di of Xi’an Jiaotong University discussed "Optimization      of Multilayer Ferroelectric Ceramic Capacitor Energy Storage      Performance";
• Prof. Ling Zhiyuan of South China University of Technology      analyzed "Electrical Characteristics of High-Stack MLCCs under      Large-Signal Conditions";
• Qiu Hong of Huawei Technologies addressed "Challenges      and Standards Development in MLCC Capacity Expansion under the New Global      Landscape";
• Wang Hao, Deputy GM of MLCC Division at Three-Circle Group,      explored "MLCC Technology Trends Driven by New Energy and AI".

Over 50 companies participated in the on-site exhibition, showcasing breakthroughs in ceramic powders, conductive pastes, dielectric formulations, precision equipment, inspection tools, and more—highlighting the rapid progress and innovative vitality of China’s MLCC supply chain.

A New Milestone for China's MLCC Industry

The successful conclusion of this year’s forum deepened communication and collaboration across the ceramic capacitor industry, promoted the dissemination of advanced technologies, and strengthened the upstream and downstream synergy within the supply chain.

Looking ahead, China’s ceramic capacitor and materials industry will continue to focus on independent innovation and coordinated development, striving to overcome bottlenecks in high-end materials and equipment, and to further enhance its position in the global electronic components value chain.