The 9th Third Council Meeting of China Electronic Components Association & 2025 China Electronic Components Industry Summit Held in Suzhou

The 9th Third Council Meeting of China Electronic Components Association & 2025 China Electronic Components Industry Summit Held in Suzhou  

Driving Innovation, Building a New Industry Ecosystem  

On August 28, 2025, the *9th Third Council Meeting of China Electronic Components Association & 2025 China Electronic Components Industry Summit*, organized by the China Electronic Components Association (CECA) and hosted by its Information Center, with support from the Capacitor Branch, Optoelectronic Cable & Optical Device Branch, and Hengtong Group, successfully concluded in Tongli Ancient Town, Suzhou, Jiangsu Province. Under the theme “Driving Innovation, Building a New Industry Ecosystem,” the summit attracted over 1,000 participants from government agencies, research institutions, industry associations, and upstream and downstream segments of the industry chain to discuss pathways for high-quality development in the electronic components sector.  

**Speeches and Keynote Reports**  

In his keynote speech, Li Yizhong, former Minister of Industry and Information Technology, emphasized the need to accelerate the building of a strong manufacturing nation through goal-oriented and problem-oriented approaches, charting a course for the industry to address international competition and technological challenges. Speeches were also delivered by Zha Yingdong, Vice Mayor of Suzhou, and Lu Zaigui, Second-Level Inspector of the Jiangsu Provincial Department of Industry and Information Technology, who acknowledged the achievements of Suzhou and the Yangtze River Delta region in building an innovation cluster for the electronic components industry.  

Qian Jianlin, Chairman of CECA, called on the industry to address weaknesses in the supply chain, cultivate globally leading enterprises, and promote intelligent and green transformation. Cui Genliang, Party Secretary of co-organizer Hengtong Group, stated that electronic components are the cornerstone of technological competition, underscoring the need to seize opportunities through domestic substitution and high-end innovation.  

**Cutting-Edge Industry Trends and Technological Breakthroughs**  

The summit featured multiple thematic reports covering advanced fields such as flexible electronics, quantum computing, and AI-enabled manufacturing. Professor Huo Fengwei from Nanjing Tech University elaborated on the industrialization path for flexible electronics, while Professor Zhu Minggang from the Central Iron & Steel Research Institute explored applications of new cerium magnets. Chen Daigao from the National Information Optoelectronics Innovation Center shared insights into the future of co-packaged optics (CPO) technology. Ma Jianqiang, General Manager of Hengtong Digital Intelligence, presented practical cases of AI-driven digital and intelligent transformation in manufacturing.  

**Awards and Ecosystem Collaboration**  

The 2025 CECA Science and Technology Awards were announced at the summit. The Tang Haoran team from South China University of Technology won the First Prize for Technological Invention for their work on “high-performance capacitors based on n-type conductive polymers,” while Xu Guoxiang from Hengtong Huahai received the Youth Science and Technology Award. The event also included the recognition of leading electronic component enterprises in 2025 and the presentation of corporate credit rating certifications, with companies such as Fenghua Advanced Technology making the list.  

**High-Level Dialogue and Collaborative Innovation**  

During the high-level dialogue session, entrepreneurs including Qian Jianlin of Hengtong, Li Cheng of Fenghua Advanced Technology, and Shi Hongyang of Sunlord Electronics discussed topics such as “curbing industry involution” and “the impact of the China-U.S. trade war,” highlighting the importance of technical standard setting and industry chain collaboration.  

The summit also featured four parallel forums focusing on specialized segments such as electrolytic capacitors and optical communication devices. The “2025 China Electronic Components Industry Chain Collaborative Innovation Exhibition” was held concurrently, with 76 companies showcasing cutting-edge technologies and products, fostering deeper integration across the industry chain.  

As one of the largest and most prestigious professional conferences in China’s electronic components industry, this summit provided an essential platform for industry exchange, cooperation, and ecosystem development, supporting the sector’s advancement toward the mid-to-high end of the global value chain.