The 2nd Semiconductor Ceramic Industry Forum Successfully Held

The 2nd Semiconductor Ceramic Industry Forum Successfully Held in WuxiOctober 31, 2025, Wuxi, Jiangsu — The "2nd Semiconductor Ceramic Industry Forum," hosted by Aibang Intelligent Manufacturing, successfully concluded on Taihu Avenue in Wuxi. The forum brought together leading experts and enterprises in the semiconductor ceramic industry chain to discuss technological innovation and industrial opportunities. Shenzhen Easontek Technology Co., Ltd. participated as a key sponsor of the forum, showcasing its advanced process equipment solutions for manufacturing semiconductor ceramic components, which attracted significant attention during the event.

Focus on Semiconductor Ceramics, Driving Industrial Upgrading

With the global expansion of wafer manufacturing capacity, the semiconductor equipment and components market is experiencing a new growth cycle. Advanced ceramics, known for their high hardness, corrosion resistance, and low thermal expansion coefficient, have become core materials for critical components such as electrostatic chucks (ESCs), ceramic heaters, and probe cards. The high-quality manufacturing of these components relies on advanced process equipment like Warm Isostatic Press (WIP) Machines and Inject Via-Filling Machines. This forum aimed to bridge innovation across the material, equipment, and application sectors, fostering collaborative development within the industry chain.

Gathering of Industry Experts to Share Cutting-Edge Technologies

The forum featured in-depth thematic reports from 13 renowned institutions and enterprises. The presentations addressed technical challenges and solutions for key ceramic components such as electrostatic chucks, aluminum nitride heaters, and silicon carbide parts, whose precision manufacturing depends on the advanced forming and processing equipment specialized by EasontekTechnology.

Easontek Technology Showcases Core Equipment, Enabling Precision Manufacturing

During the exhibition session, Shenzhen Easontek Technology Co., Ltd. highlighted its core equipment designed for semiconductor ceramic component manufacturing. Focusing on industry challenges in producing electrostatic chucks (ESCs), ceramic heaters, and probe cards, Yuchen Technology presented its Warm Isostatic Press (WIP) Machines for ensuring material density and uniformity, and  Inject Via-Filling Machines for high-precision filling of deep and complex holes. These solutions provide critical process support for improving component yield and reliability, attracting extensive interest from experts and manufacturers.

Collaborating for a Shared Future

The forum served as an efficient collaboration platform for the semiconductor ceramic industry chain, featuring thematic reports, exhibition exchanges, and interactive sessions. Special thanks to Shenzhen EasontekTechnology Co., Ltd. and other supporting enterprises for their strong sponsorship and support, injecting robust momentum into equipment innovation and process breakthroughs within the industry chain.

About Shenzhen Easontek Technology Co., Ltd.
Shenzhen EasontekTechnology Co., Ltd. specializes in the R&D and manufacturing of electronic ceramic process equipment. As a leading domestic provider of forming and processing equipment solutions for semiconductor ceramic components, the company’s core products include Warm Isostatic Press (WIP) Machines and Inject Via-Filling Machines. These are widely used in the manufacturing of high-end semiconductor ceramic components such as electrostatic chucks (ESCs), ceramic heaters, and probe cards, providing efficient and high-precision equipment technology to support the autonomous, controllable, and innovative development of China's semiconductor industry